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Faridabad, 3rd March 2026: The 1st International Electronics, Packaging, Design & Manufacturing Conference EPDMC 2026 concluded today at Manav Rachna International Institute of Research and Studies (MRIIRS), bringing together global semiconductor leaders, researchers, industry experts, startups, and policymakers. The three-day conference was organised under the IEEE Electronics Packaging Society in collaboration with the IEEE EPS Delhi Chapter, was held under the theme “Bridging Skills and Innovation for India’s Industry.”
Dr. Prashant Bhalla, President of Manav Rachna Educational Institutions, noted, “India’s electronics production has crossed $100 billion, and the electronic system design and manufacturing sector is emerging as a key pillar of economic growth. While India is recognised for its semiconductor design talent, we are strengthening manufacturing, packaging, testing, and system integration capabilities to build a resilient ecosystem.”
Ajit Manocha, President and CEO of SEMI, delivered the keynote, stating, “We are at a massive inflection point. Global IC revenue is projected to reach $1 trillion in 2026 and $2 trillion by 2035, driven by IoT, AI, and quantum technologies. AI is accelerating innovation, enabling more functionality per device and more devices per system, while redefining energy efficiency for data centres. Heterogeneous integration and advanced packaging will support high-performance computing, automotive, medical, and emerging applications over the next decade.”
Ravi Mahajan, Fellow, Advanced Packaging Technology Manufacturing at Intel Corporation, highlighted the role of heterogeneous integration and AI in energy-efficient, high-performance systems. “Data centres consume massive amounts of power, and improving efficiency is both an economic and environmental imperative. Heterogeneous integration is the way forward. The Heterogeneous Integration Roadmap (HIR) unites ecosystems across computing, mobile, aerospace and defence, medical, automotive, and IoT, integrating advances in materials, photonics, sensors, design, manufacturing, test, and thermal management.”
Mahajan added, “AI combined with heterogeneous integration opens tremendous opportunities for research, innovation, and technology development. The roadmap helps countries and companies navigate the geopolitical, technological, and economic shifts in the semiconductor ecosystem. It is our roadmap, and collectively, we will drive this forward.”
Prof. (Dr.) Ashwini Kumar Aggarwal, Founder & Chair of the IEEE EPS NCR Chapter, shared the vision behind EPS and EPDMC 2026. “While the IEEE Delhi Section has 8,700 members, there was no dedicated platform for electronics packaging engagement in northern India. EPS was launched to address this, and over the past year, we conducted 17 events without relying on IEEE resources. About a year ago, we conceptualised EPDMC to bring together academia, industry, and global leadership to strengthen India’s electronics ecosystem.”
Aggarwal explained, “The conference shifts the focus from volume manufacturing to creating value and integration across the supply chain. Academic tracks are contributed by leading universities, while corporate partners support industry tracks. Discussions cover emerging technologies, including quantum systems, and strategies to strengthen India’s semiconductor ecosystem. Supported by Dr. Ravi Mahajan and Aditya Sonocha for global guidance, the conference promotes mentorship, collaboration, and industry-academia networking.”
The programme featured technical tracks on heterogeneous integration, 3D ICs, fan-out and wafer-level packaging, reliability and thermal management, AI-driven optimisation, and sustainable semiconductor manufacturing. Panels addressed skill development, OSAT and EMS readiness, photonics integration, and applications across automotive, aerospace, IoT, and quantum technologies.
Aligned with Make in India and the India Semiconductor Mission, EPDMC 2026 included the release of qualification packs for semiconductor packaging and sessions on accelerating AI through high-bandwidth hybrid photonics, strengthening design-for-manufacturing and design-for-packaging alignment.
Dr. Umesh Dutta, CEO, MRIIF and Associate Professor, Department of ECE, emphasised, “The conference is a collaborative platform for industry, academia, and ecosystem stakeholders to enhance capability building across the semiconductor value chain.” Sustainability is embedded across sessions, covering wide bandgap semiconductors like SiC and GaN, and energy-efficient AI architectures using advanced interconnects and photonics.
The conference programme featured advanced technical sessions, expert tutorials, and industry-focused workshops across semiconductor design, manufacturing, packaging, and emerging technologies. Dr. Meena Mishra, Outstanding Scientist (OS) and Director, Solid State Physics Laboratory (SSPL), DRDO, spoke on the importance of electronics manufacturing from India’s perspective and emphasised the need to strengthen capabilities across the semiconductor value chain, including materials, fabrication, packaging, and system-level integration.
Founded in 1997, Manav Rachna Educational Institutions (MREI) stand as a symbol of excellence in education, providing high-quality learning across diverse fields. With over 43,000 alumni, 135+ global academic collaborations, and 80+ Innovation & Incubation Entrepreneurial Ventures, MREI is home to premier institutions, including Manav Rachna University (MRU), Manav Rachna International Institute of Research & Studies (MRIIRS) – NAAC A++ Accredited, and Manav Rachna Dental College (under MRIIRS) – NABH Accredited. MREI also operates twelve schools nationwide, offering Indian and International curricula such as IB and Cambridge. Consistently ranked among the top in India by NIRF-MHRD, TOI, Outlook, Business World, ARIIA, and Careers360, MREI's achievements reflect its commitment to quality education. MRIIRS is recognised in the QS World University Rankings 2026, in addition to holding QS 5-Star ratings for Teaching, Employability, Academic Development, Facilities, Social Responsibility, and Inclusiveness. MRIIRS has been in the Top 100 Universities list in the NIRF Rankings for 2 consecutive years with Rank 96 overall and Rank 33 in the Dental Category.
For more details visit our website: https://manavrachna.edu.in/
