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Xiaomi has launched the Xring O3, its second in-house smartphone processor, marking a fresh push to build its own chip technology. The chip will power Xiaomi's next flagship foldable phone, as the company also works on chips for artificial intelligence and self-driving cars.
TSMC will make the Xring O3 using its 3-nanometer process. Xiaomi plans to ship around 200,000 to 300,000 units at first. That small number shows Xiaomi is testing the chip carefully through one premium device rather than rolling it out across all its phones right away.
Building its own processor gives Xiaomi more say over how a phone's computing, graphics, AI, and camera systems work together. This lets the company shape features around its own hardware and software instead of relying only on chips from Qualcomm or MediaTek.
The move also gives Xiaomi more freedom to plan its product lineup and lowers its reliance on outside chipmakers. As phone brands compete on AI features and steady supply chains, this kind of control is becoming a real edge.
Xiaomi's chip plans stretch past smartphones. The company is working on the Xring O100 for its MiMo AI model and the Xring D100 for self-driving systems. It has put more than 20 billion yuan, close to $3 billion, into chip development and grown its chip team to over 3,000 people.
The O3 will show whether Xiaomi can turn chip design into a lasting strength. Shipment numbers are small for now, but if the chip performs well, Xiaomi could gain more control across phones, AI tools, and cars, all while keeping its devices affordable and competitive.
Also Read: Xiaomi Pad 7 Ultra Unveiled: 14" OLED Display and Xring O1 Chipset
