The global electronics manufacturing industry is undergoing rapid transformation. The increasing complexity of devices, shrinking component sizes, and the rise of smart and connected systems are placing unprecedented demands on production workflows. Printed circuit boards, the backbone of modern electronics, are at the center of this shift. Manufacturers must deliver high reliability while adapting to environmental regulations, supply chain pressures, and the integration of advanced digital technologies.
To better understand these evolving dynamics, we spoke with Harshitkumar Ghelani, an electronics engineer and Production Manager with deep expertise in high-reliability PCB manufacturing, process engineering, quality assurance, and end-to-end production management. With hands-on experience across the full PCB fabrication cycle—including material planning, layer scaling, imaging, drilling, lamination, plating, AOI inspection at every layer, surface finishing, and final testing—he has led complex manufacturing projects involving 16- and 20-layer hybrid boards with multiple lamination cycles and over 37 controlled process steps.
Harshitkumar has a strong track record in process optimization and root cause analysis In addition to his operational leadership, he brings research depth to manufacturing practice, with multiple published research papers focused on Six Sigma, additive manufacturing in electronics, and AI-driven quality control. His combined expertise in production leadership, laboratory testing, equipment calibration systems, and continuous improvement makes him a recognized voice in advancing reliable, high-layer PCB manufacturing in modern electronics industries.
Ghelani: Manufacturing high-density and miniaturized PCBs presents several interrelated challenges. First, the tolerances are extremely tight. Even micrometer-level deviations in trace width or layer alignment can compromise signal integrity, leading to failures in high-speed circuits. Second, as the number of layers in boards increases, internal thermal management becomes critical. Excess heat can degrade solder joints and components, so design and process controls must anticipate thermal stresses. Third, quality assurance is particularly challenging because traditional inspection methods are often inadequate for dense multilayer boards. We address these by combining advanced inspection techniques, such as X-ray imaging and cross-sectional analysis, with predictive analytics that track deviations and process drift. This allows us to proactively intervene before defects propagate, maintaining high reliability even in complex assemblies.
Ghelani: Many manufacturing issues arise from small process variations that accumulate over time. By implementing data-driven process control systems, manufacturers can continuously monitor parameters such as temperature, pressure, chemical bath concentration, and humidity during PCB fabrication. We have developed protocols where statistical process control is combined with root cause analysis algorithms. For example, if an increase in ionic contamination is detected, the system can trace it back to a specific batch of chemicals or a specific line operator procedure. This approach has allowed us to reduce defects by over 20 percent in certain lines while also decreasing inspection time. The combination of advanced analytics and hands-on process engineering creates a feedback loop that strengthens both quality and efficiency.
Ghelani: Supply chain disruptions exist because they contain multiple different aspects. Material shortages and geopolitical risks, together with sudden demand spikes, create obstacles that prevent production from running smoothly. The sudden unavailability of high-quality laminates and copper foils will completely stop all production operations. The solution requires a multi-pronged approach: diversifying suppliers across geographies, maintaining strategic inventory buffers, and implementing real-time supply monitoring systems. We qualify alternative materials ahead of time because some materials will face shortages, which require us to maintain production with minimal quality loss. The company achieves operational transparency through better vendor collaboration and digital order tracking, which enables it to respond quickly to delays and inconsistencies.
Ghelani: High-density PCBs need testing because multilayer boards and fine-pitch components require special testing methods. The testing process needs more than just traditional functional testing methods. Our organization uses three different testing methods, which include chemical analysis, electrical impedance testing, and failure analysis through cross-section and X-ray inspection. Our organization developed a new system that uses ionic contamination data together with past defect patterns to forecast which circuit boards will experience early-life failures. The predictive method enables us to select circuit boards for specific tests, which decreases total inspection work while enhancing testing accuracy. The results have been measurable: the incidence of early failures dropped by nearly 15 percent over two years in a pilot line.
Ghelani: AI has developed into a fundamental component that organizations use to track processes and make strategic choices. For instance, machine learning models can analyze real-time production data to detect subtle deviations from normal patterns that might indicate a future defect. The system enables users to make operational changes in advance of problems instead of waiting for issues to arise. Our organization employs artificial intelligence to enhance chemical bath cycle efficiency and drying time management, which results in less waste and more reliable outcomes. AI technology extends its benefits beyond manufacturing operations by helping organizations manage materials through its ability to evaluate supplier performance and anticipate delivery delays, which builds a supply chain that can better handle disruptions and operate more flexibly.
Ghelani: Automated systems require human expertise to be successful. Engineers need to analyze complex test results because they need to solve unpredictable problems and operate advanced technology. The main problem exists because most conventional PCB engineers learned their skills before artificial intelligence and intelligent manufacturing systems became common. The organization established ongoing training initiatives to address the skills gap. These programs teach data analytics, automated inspection system operation, and production workflow knowledge to their participants. The organization implements a mentoring system that matches experienced engineers with less experienced engineers to solve complex problems. This system helps transfer knowledge while encouraging work on new ideas.
Ghelani: A recurring issue in some high-volume PCB lines was micro-cracking in solder joints due to thermal stress during reflow. Traditional solutions involved slower reflow profiles or more stringent component selection, which impacted productivity. By analyzing process parameters and material interactions, we redesigned the thermal profile using both simulation and experimental validation. Additionally, we optimized the flux chemistry to reduce surface tension inconsistencies. The result was a 30 percent reduction in micro-cracking without reducing throughput, demonstrating how targeted engineering solutions can directly mitigate persistent industry challenges.
Ghelani: Regulatory compliance has become a central factor in process design. Lead-free solder mandates, restrictions on hazardous chemicals, and waste management standards require process modifications. We approach this by redesigning workflows to minimize chemical usage, recycling solvents where possible, and adopting greener alternatives for laminates and resins. Beyond compliance, many clients now expect sustainability reporting, so traceability and documentation are embedded in every step. The dual challenge is maintaining performance and meeting environmental goals simultaneously.
Ghelani: Flexible electronics, embedded components, and additive manufacturing are poised to transform the industry. Additive manufacturing enables rapid prototyping of complex circuits and reduces material waste. Embedded components reduce assembly steps but require higher precision in fabrication and inspection. Combined with AI-driven process control, these technologies will allow manufacturers to produce highly complex boards more efficiently and reliably. We are actively evaluating pilot projects to integrate these methods into mainstream production, anticipating that they will set new benchmarks for quality and speed.
Ghelani: The key is integration of technology, data, and expertise. Stakeholders must invest in process monitoring, predictive analytics, and workforce development simultaneously. Solving one issue without addressing the others will lead to limited results. Additionally, collaboration with suppliers and research partners can accelerate problem-solving and innovation. Finally, adopting a mindset that views challenges as opportunities for process improvement rather than obstacles is critical. Organizations that master this triad will lead the industry in reliability, efficiency, and sustainability.
The PCB and electronics manufacturing sector is at a crossroads where complexity, precision, and sustainability intersect. Leaders like Harshitkumar Ghelani demonstrate that a combination of advanced process engineering, data-driven problem solving, and workforce expertise is essential to navigate these challenges. Key takeaways include:
Predictive analytics and AI integration are critical for reducing defects and improving operational efficiency
Workforce training and knowledge transfer remain central to sustaining innovation
Environmental and regulatory compliance drive process adaptation and material innovation
Emerging technologies, including additive manufacturing and flexible electronics, will define the next generation of PCB production
The industry outlook is optimistic for companies that combine technical innovation, strategic problem-solving, and sustainability-focused practices, ensuring continued growth and resilience in a rapidly evolving electronics landscape.