Samsung Steps Up Its Game in the Race for the Fastest AI Chip

IndustryTrends

Samsung Electronics is intensifying efforts to enter the high bandwidth memory 3 (HBM3) market.

As generative AI becomes prevalent, the top memory chip makers in the world need to boost the output of HBM chips.

HBM chips use less energy and process data at faster speeds than conventional DRAMs.

Each HBM3 chip has a 16 GB memory capacity and the industry's lowest energy usage.

It provided samples of the industry's slimmest 12-layer 24 GB HBM3, a fourth-generation HBM chip.

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